EP3SL70F484I4LG vs EP3SL70F484C4N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F484I4LG disebabkan oleh Intel dan EP3SL70F484C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SL70F484C4N EP3SL70F484C4N - Stratix III L FPGA 67.5K LE FBGA-484 | Intel

EP3SL70F484C4N - Stratix III L FPGA 67.5K LE FBGA-484 | Intel

EP3SL70F484C4N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL70F484I4LG EP3SL70F484C4N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Masa Terakhir Dibeli
Series Stratix III L —
Family Stratix III (low-static-power variant) Stratix III L
Process Node 40 nm —
Logic Elements (LE) 67,500 —
Adaptive Logic Modules (ALM) 27,000 —
Embedded Memory (Bits) 2,699,264 —
Embedded Block RAM 2.57 Mbit —
Number of User I/Os 296 —
Kemasan 484-BBGA, FCBGA —
Operating Supply Voltage (Core) 1.1 V —
Suhu Operasi -40 C to +100 C (Industrial) 0C to +85C (Commercial, TJ)
Gaya Pemasangan SMD/SMT —
Speed Grade I4 (industrial, -4 speed bin) -C4
Status RoHS Compliant (lead-free FCBGA) Compliant
Programming Toolchain Quartus II / Quartus Prime (Intel FPGA) —
Logic Elements — 67,500
Adaptive Logic Modules (ALMs) — 33,880
LABs/CLBs — 2,700
Number of Logic Cells / Gates — 67,500
Embedded Memory (Block RAM) — 2,699,264 bits (2.7 Mbit)
Number of I/Os — 296
Number of Transceivers — [DATA_NEEDED: number of embedded transceivers]
Core Voltage — 1.1 V
Process Technology — 65 nm
Package Type — 484-ball FCBGA (FineLine BGA)
Package Code — F484
Ball Pitch — 1.0 mm
Jenis Pemasangan — Surface Mount
Configuration Mode — JTAG, Passive Serial, Fast Passive Parallel, Host Bus
Aras MSL — 3

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