EP3SL70F780C3 vs EP3SE50F780C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780C3 disebabkan oleh Intel dan EP3SE50F780C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL70F780C3 | EP3SE50F780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III L | — |
| Family | Stratix III | Stratix III E |
| Logic Elements (LE) | 67,500 | 47,500 |
| Embedded Memory (bits) | 2,699,264 | — |
| Logic Array Blocks (LABs) | 2,700 | — |
| User I/O Count | 488 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Number of Pins / Balls | 780 | — |
| Kemasan | 780-BBGA, FC-FBGA | 780-ball FC-FBGA (FineLine BGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Process Technology | 65 nm | 65 nm |
| Core Voltage (VCCINT) | 1.1 V | — |
| Maximum Internal Clock Frequency | 500 MHz | — |
| Gambaran Suhu Operasi | 0°C to 85°C (commercial) | — |
| Speed Grade | C3 | — |
| Design Software | Quartus II (last supported v13.1) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Embedded Memory (BRAM) | — | 5,760 Kbits |
| User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Logic Voltage | — | 0.9 V |
| Transceiver Speed (max) | — | 500 MHz |
| Total LABs/CLBs | — | 1900 |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Suhu Operasi | — | 0C to +85C (Commercial grade, 'C' suffix) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |