EP3SL70F780C4G vs EP3SL70F780I3G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780C4G disebabkan oleh Intel dan EP3SL70F780I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SL70F780C4G EP3SL70F780C4G - 67.5K LE Stratix III L FPGA, 488 I/O, FCBGA-780 | Intel

EP3SL70F780C4G - 67.5K LE Stratix III L FPGA, 488 I/O, FCBGA-780 | Intel

EP3SL70F780C4G ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL70F780C4G EP3SL70F780I3G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli NRND
Family Stratix III L Stratix III L
Logic Elements (LE) 67,500 67,500
Adaptive Logic Modules (ALM) 27,000 27,000 ALM
Embedded Memory 2,699,264 bits (2.57 Mbit) 2,699,264 bits (2.57 Mbit)
Maximum User I/O 488 —
Kemasan 780-ball FCBGA (Flip-Chip BGA) 780-BBGA, FCBGA (29x29 mm)
Operating Supply Voltage (Core) 1.1 V —
Speed Grade C4 (commercial) 3 (Medium)
Gambaran Suhu Operasi 0C to +85C (Commercial) —
Jenis Pemasangan Surface Mount (SMD/SMT) Surface Mount
Process Node 40 nm TSMC low-power —
Number of PLLs 8 —
DSP Multipliers (18x18) [DATA_NEEDED: DSP block count] —
Configuration Modes PS, FPP, AS, JTAG —
Status RoHS Compliant Compliant
Aras MSL 3 —
User I/Os — 488
Core Voltage (VCCINT) — 1.1 V
Suhu Operasi — -40C to +100C (Industrial)
Process Technology — 40 nm TSMC
Jenis Ingatan — SRAM-based, external configuration
DSP Blocks — Multipliers, count varies by die
Configuration — External (EPCS / JTAG)
Packaging — Tray

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