EP3SL70F780C4G vs EP3SL70F780I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780C4G sa pamamagitan ng Intel at EP3SL70F780I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL70F780C4G - 67.5K LE Stratix III L FPGA, 488 I/O, FCBGA-780 | Intel
EP3SL70F780C4G ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SL70F780C4G | EP3SL70F780I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix III L | Stratix III L |
| Logic Elements (LE) | 67,500 | 67,500 |
| Adaptive Logic Modules (ALM) | 27,000 | 27,000 ALM |
| Embedded Memory | 2,699,264 bits (2.57 Mbit) | 2,699,264 bits (2.57 Mbit) |
| Maximum User I/O | 488 | — |
| Packhaging | 780-ball FCBGA (Flip-Chip BGA) | 780-BBGA, FCBGA (29x29 mm) |
| Operating Supply Voltage (Core) | 1.1 V | — |
| Speed Grade | C4 (commercial) | 3 (Medium) |
| Hanay ng Temperature na Operasyon | 0C to +85C (Commercial) | — |
| Uri ng Pagpapasok | Surface Mount (SMD/SMT) | Surface Mount |
| Process Node | 40 nm TSMC low-power | — |
| Number of PLLs | 8 | — |
| DSP Multipliers (18x18) | [DATA_NEEDED: DSP block count] | — |
| Configuration Modes | PS, FPP, AS, JTAG | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 | — |
| User I/Os | — | 488 |
| Core Voltage (VCCINT) | — | 1.1 V |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Process Technology | — | 40 nm TSMC |
| Uri ng Memory | — | SRAM-based, external configuration |
| DSP Blocks | — | Multipliers, count varies by die |
| Configuration | — | External (EPCS / JTAG) |
| Packaging | — | Tray |