EP4CE55F23C9L vs EP4CE55F23C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE55F23C9L disebabkan oleh Intel dan EP4CE55F23C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE55F23C9L | EP4CE55F23C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory | 2,396,160 bits (2.5 Mbit) | 2,340 Kbit (M9K blocks) |
| Embedded 18x18 Multipliers | 156 | — |
| PLLs | 4 | 4 general-purpose |
| User I/Os | 324 | — |
| Kemasan | 484-ball FBGA (F23) | 484-ball FBGA (F23) |
| Speed Grade | C9 (fastest commercial/industrial) | 8 (Commercial) |
| Suhu Operasi | -40C to +85C (industrial) | 0 C to +85 C (Commercial, C8) |
| Process Node | 60 nm low-power | — |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Configuration Method | SRAM-based, requires external flash | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant (Pb-free) |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Hard PCIe Blocks | 0 (soft PCIe via fabric) | — |
| Logic Elements | — | 55,856 LE |
| Embedded Multipliers | — | 156 (18x18) |
| Maximum User I/O Pins | — | 324 |
| Process Technology | — | 60 nm low-power CMOS |
| Global Clock Networks | — | 20 |
| Lead-Free Finish | — | Yes (N suffix) |