EP4CE55F23C9L vs EP4CE55F23C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F23C9L sa pamamagitan ng Intel at EP4CE55F23C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE55F23C9L | EP4CE55F23C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory | 2,396,160 bits (2.5 Mbit) | 2,340 Kbit (M9K blocks) |
| Embedded 18x18 Multipliers | 156 | — |
| PLLs | 4 | 4 general-purpose |
| User I/Os | 324 | — |
| Packhaging | 484-ball FBGA (F23) | 484-ball FBGA (F23) |
| Speed Grade | C9 (fastest commercial/industrial) | 8 (Commercial) |
| Temperature na Operasyon | -40C to +85C (industrial) | 0 C to +85 C (Commercial, C8) |
| Process Node | 60 nm low-power | — |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Configuration Method | SRAM-based, requires external flash | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant (Pb-free) |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Hard PCIe Blocks | 0 (soft PCIe via fabric) | — |
| Logic Elements | — | 55,856 LE |
| Embedded Multipliers | — | 156 (18x18) |
| Maximum User I/O Pins | — | 324 |
| Process Technology | — | 60 nm low-power CMOS |
| Global Clock Networks | — | 20 |
| Lead-Free Finish | — | Yes (N suffix) |