EP4CE55F23C9L vs EP4CE55F23I8L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE55F23C9L disebabkan oleh Intel dan EP4CE55F23I8L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE55F23C9L | EP4CE55F23I8L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | — |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory | 2,396,160 bits (2.5 Mbit) | — |
| Embedded 18x18 Multipliers | 156 | 156 |
| PLLs | 4 | — |
| User I/Os | 324 | — |
| Kemasan | 484-ball FBGA (F23) | 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) |
| Speed Grade | C9 (fastest commercial/industrial) | 8 |
| Suhu Operasi | -40C to +85C (industrial) | — |
| Process Node | 60 nm low-power | — |
| Core Voltage | 1.2 V (typical) | — |
| Configuration Method | SRAM-based, requires external flash | — |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Status RoHS | Compliant | Compliant |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Hard PCIe Blocks | 0 (soft PCIe via fabric) | — |
| Device Family | — | Cyclone IV E |
| Logic Elements (LEs) | — | 55,856 |
| Embedded Memory Bits | — | 2,396,160 bits (~234 Kbit / ~292.5 KByte) |
| Maximum User I/O Pins | — | 324 |
| General-Purpose PLLs | — | 4 |
| Process Technology | — | 60 nm |
| Core Supply Voltage | — | 1.2 V |
| Gambaran Suhu Operasi | — | -40C to +100C (Industrial) |
| Configuration Modes | — | AS, PS, JTAG |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X |
| Lead-Free / Halogen-Free | — | Yes / Yes |