EP4CE55F23C9L vs EP4CE55F23I8L 比較
詳細並排比較 EP4CE55F23C9L 由 Intel 與 EP4CE55F23I8L 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP4CE55F23C9L | EP4CE55F23I8L |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone IV E | — |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory | 2,396,160 bits (2.5 Mbit) | — |
| Embedded 18x18 Multipliers | 156 | 156 |
| PLLs | 4 | — |
| User I/Os | 324 | — |
| 封裝 | 484-ball FBGA (F23) | 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) |
| Speed Grade | C9 (fastest commercial/industrial) | 8 |
| 工作溫度 | -40C to +85C (industrial) | — |
| Process Node | 60 nm low-power | — |
| Core Voltage | 1.2 V (typical) | — |
| Configuration Method | SRAM-based, requires external flash | — |
| 安裝類型 | Surface Mount (BGA) | — |
| RoHS 狀態 | Compliant | Compliant |
| MSL 等級 | [DATA_NEEDED: MSL level] | — |
| Hard PCIe Blocks | 0 (soft PCIe via fabric) | — |
| Device Family | — | Cyclone IV E |
| Logic Elements (LEs) | — | 55,856 |
| Embedded Memory Bits | — | 2,396,160 bits (~234 Kbit / ~292.5 KByte) |
| Maximum User I/O Pins | — | 324 |
| General-Purpose PLLs | — | 4 |
| Process Technology | — | 60 nm |
| Core Supply Voltage | — | 1.2 V |
| 工作溫度範圍 | — | -40C to +100C (Industrial) |
| Configuration Modes | — | AS, PS, JTAG |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X |
| Lead-Free / Halogen-Free | — | Yes / Yes |