EP4SGX110HF35C2G vs EP4SGX110HF35I3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX110HF35C2G disebabkan oleh Intel dan EP4SGX110HF35I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX110HF35C2G | EP4SGX110HF35I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 105,600 | 105,600 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 9,793,536 | 9,793,536 (9.4 Mbit) |
| Embedded Memory Blocks (M9K/M144K) | [DATA_NEEDED: block count] | — |
| User I/O Pins | 488 | — |
| Multi-Gigabit Transceivers | Up to 8.5 Gbps | 8 channels (3.125 Gbps to 8.5 Gbps per family datasheet) |
| Number of Transceivers | [DATA_NEEDED: channel count] | — |
| Hard Memory Controllers | [DATA_NEEDED: yes/no] | — |
| Hard PCIe Blocks | Yes (Gen1/Gen2) | — |
| DSP Blocks | [DATA_NEEDED: count] | — |
| Process Technology | 40 nm | 40 nm low-power CMOS |
| Core Voltage (VCC) | 0.9 V | — |
| Kemasan | 1152-ball FC-FBGA (HF35, 35 mm body) | 1152-ball FC-FBGA (HF35), 35 x 35 mm, 1.0 mm pitch |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Operating Temperature Grade | Commercial (C2) | — |
| Status RoHS | Compliant | Compliant |
| Speed Grade | 2 (core speed bin) | — |
| Maximum User I/O Pins | — | 488 |
| Multipliers (18x18) | — | 352 |
| Core Supply Voltage (nominal) | — | 0.9 V |
| Speed/Grade | — | I3 (Industrial, -3 speed) |
| Suhu Hubungan Operasi | — | -40 C to +100 C |
| Hard IP Blocks | — | PCIe Gen1/Gen2, external memory PHY |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free / Halogen-Free | — | Lead-free |
| Configuration Memory | — | SRAM-based (volatile, requires configuration device) |