EP4SGX230HF35I4G vs EP4SGX230DF29I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX230HF35I4G disebabkan oleh Intel dan EP4SGX230DF29I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX230HF35I4G | EP4SGX230DF29I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 228,000 | 228000 |
| Embedded Memory (Bits) | 17,544,192 | — |
| Embedded Memory (Mbit) | 17.5 Mbit | — |
| 18x18 Multipliers | 1,728 | — |
| User I/O Pins | 564 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| Kemasan | 1152-ball FCBGA (HF35) | — |
| Suhu Operasi | -40C to +100C (Industrial) | -40C to +100C (TJ) |
| Core Voltage | 0.93 V | — |
| Process Node | 40 nm | — |
| Hard PCIe IP Cores | PCIe Gen1/Gen2 (x1/x4/x8) | — |
| PLLs | 24 | — |
| LVDS Performance | 1,335 Mbit/s | — |
| Configuration Scheme | Passive Serial, Fast Passive Parallel, JTAG | — |
| Status RoHS | Compliant | Compliant (per distributor listing) |
| Jenis Pemasangan | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Series | — | EP4SGX230 |
| Number of LABs/CLBs | — | 9120 |
| Number of Logic Elements/Cells | — | 228000 |
| Total RAM Bits | — | 17544192 |
| Number of I/O | — | 372 |
| Voltage - Supply | — | 0.87 V to 0.93 V |
| Kemasan / Case | — | 780-BBGA, FCBGA |
| Supplier Device Package | — | 780-FBGA (29x29 mm) |
| Programmable | — | Not Verified (per distributor listing) |
| Part Status | — | Obsolete |