EP4SGX230HF35I4G vs EP4SGX230DF29I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX230HF35I4G sa pamamagitan ng Intel at EP4SGX230DF29I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX230HF35I4G | EP4SGX230DF29I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 228,000 | 228000 |
| Embedded Memory (Bits) | 17,544,192 | — |
| Embedded Memory (Mbit) | 17.5 Mbit | — |
| 18x18 Multipliers | 1,728 | — |
| User I/O Pins | 564 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| Packhaging | 1152-ball FCBGA (HF35) | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (TJ) |
| Core Voltage | 0.93 V | — |
| Process Node | 40 nm | — |
| Hard PCIe IP Cores | PCIe Gen1/Gen2 (x1/x4/x8) | — |
| PLLs | 24 | — |
| LVDS Performance | 1,335 Mbit/s | — |
| Configuration Scheme | Passive Serial, Fast Passive Parallel, JTAG | — |
| Tindminan RoHS | Compliant | Compliant (per distributor listing) |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Series | — | EP4SGX230 |
| Number of LABs/CLBs | — | 9120 |
| Number of Logic Elements/Cells | — | 228000 |
| Total RAM Bits | — | 17544192 |
| Number of I/O | — | 372 |
| Voltage - Supply | — | 0.87 V to 0.93 V |
| Packhaging / Kaso | — | 780-BBGA, FCBGA |
| Supplier Device Package | — | 780-FBGA (29x29 mm) |
| Programmable | — | Not Verified (per distributor listing) |
| Part Status | — | Obsolete |