EP4SGX360HF35C2 vs EP4SGX360HF35I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX360HF35C2 disebabkan oleh Intel dan EP4SGX360HF35I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP4SGX360HF35I3N - Stratix IV GX FPGA, 353K LE, 1152-FBGA | Intel
EP4SGX360HF35I3N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP4SGX360HF35C2 | EP4SGX360HF35I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Series | Stratix IV GX | — |
| Family | Stratix IV GX FPGA | Stratix IV GX |
| Logic Elements (LEs) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Number of I/O | 564 (max 532 user I/O) | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Number of Logic Cells | 353,600 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| Transceivers | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) | Up to 24 channels |
| Package Type | 1152-pin FC-FBGA | — |
| Package Code | HF35 (35x35 mm, 1.0 mm pitch) | — |
| Jenis Pemasangan | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Suhu Operasi | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Status RoHS | Compliant | — |
| Configuration | JTAG / Active Serial (external config device) | — |
| Design Tool | Quartus II / Quartus Prime | — |
| Logic Elements (LE) | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | 141,440 |
| Logic Array Blocks (LABs) | — | 14,144 |
| User I/Os | — | 564 |
| Block RAM (M9K + M144K) | — | 22.4 Mbits |
| Embedded Multipliers (18x18) | — | 1,040 |
| Max Transceiver Data Rate | — | 8.5 Gbps |
| PCIe Hard IP | — | Gen1/Gen2 x1/x2/x4 |
| Kemasan | — | 1152-ball FC-FBGA (HF35, 35x35 mm) |
| Lead Free | — | Yes |