EP4SGX530HH35I3N vs EP4SGX530HH35C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX530HH35I3N disebabkan oleh Intel dan EP4SGX530HH35C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP4SGX530HH35C4N - 531K LE Stratix IV GX FPGA | Intel | 1152-FCBGA
EP4SGX530HH35C4N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP4SGX530HH35I3N | EP4SGX530HH35C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Family | Stratix IV GX | Stratix IV GX |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 531,200 | 531,200 |
| Adaptive Logic Modules (ALMs) | 21,248 | — |
| Embedded Memory (bits) | 28,033,024 | — |
| Logic Blocks / LABs | 21,248 | — |
| Maximum User I/Os | 564 | — |
| DSP Blocks | 1,024 (18x18 multipliers) | — |
| Transceivers | 24 channels | Up to 24 channels at up to 8.5 Gbps (family maximum) |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PLLs | 8 (fractional support) | — |
| Suhu Operasi | -40C to +85C (industrial) | — |
| Internal Frequency (max) | 800 MHz | — |
| Kemasan | 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch | 1152-ball FCBGA (Flip-Chip BGA) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Aras MSL | 3 | [DATA_NEEDED: MSL level] |
| Process Node | 40 nm | — |
| Logic Array Blocks (LABs) | — | 21,248 |
| Total RAM Bits | — | 28,033,024 (approximately 28 Mb) |
| User I/O Pins | — | 564 |
| Process Technology | — | 40 nm CMOS |
| Core Voltage (typical) | — | 0.9 V |
| Speed Grade | — | C4 |
| Temperature Grade | — | Commercial |
| Lead-Free / RoHS | — | Yes (RoHS compliant per N designator) |
| Status Lingkungan Hidup | — | Last Time Buy (mature device, recommended for new designs migrating to Stratix 10 or Agilex) |