EP4SGX70DF29I3G vs EP4SGX70DF29I4N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX70DF29I3G disebabkan oleh Intel dan EP4SGX70DF29I4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP4SGX70DF29I3G EP4SGX70DF29I4N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif NRND
Series Stratix IV GX —
Process Technology 40 nm 40 nm
Logic Elements (LE) 72,600 —
Embedded Memory Bits 7,564,880 (about 7.5 Mbit) —
Embedded Memory Blocks 72600 —
Number of Logic Cells / Arrays 372 —
Number of User I/O Pins 372 —
Number of Transceiver Channels [DATA_NEEDED: exact channel count for this device] —
Transceiver Data Rate [DATA_NEEDED: per-channel data rate] —
Package Type 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) —
Package Code DF29 —
Operating Temperature Grade Industrial (I3) —
Junction Temperature Range -40C to +100C —
Core Supply Voltage 0.87 V to 0.93 V —
Speed Grade -3 I4
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Aras MSL [DATA_NEEDED: MSL rating] —
Status RoHS Compliant —
Boson Bebas [DATA_NEEDED: halogen-free claim] —
Family — Stratix IV GX
Logic Elements — 72,600
Logic Array Blocks (LABs/CLBs) — 2,904
Total RAM Bits — 7,564,880
User I/Os — 372
Core Voltage — 0.9 V
Kemasan — 780-BBGA, FC-FBGA (DF29), 29 x 29 mm
Suhu Operasi — -40C to +100C (industrial)
Lead-Free / RoHS — Yes (lead free per supplier listings)
Cell Count — 72,600 cells
Maximum Frequency — 717 MHz
Supplier Package Code — FBGA-780 (DF29)

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