EP4SGX70DF29I3G vs EP4SGX70DF29I4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX70DF29I3G sa pamamagitan ng Intel at EP4SGX70DF29I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP4SGX70DF29I3G EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

EP4SGX70DF29I3G ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro EP4SGX70DF29I3G EP4SGX70DF29I4N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo NRND
Series Stratix IV GX —
Process Technology 40 nm 40 nm
Logic Elements (LE) 72,600 —
Embedded Memory Bits 7,564,880 (about 7.5 Mbit) —
Embedded Memory Blocks 72600 —
Number of Logic Cells / Arrays 372 —
Number of User I/O Pins 372 —
Number of Transceiver Channels [DATA_NEEDED: exact channel count for this device] —
Transceiver Data Rate [DATA_NEEDED: per-channel data rate] —
Package Type 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) —
Package Code DF29 —
Operating Temperature Grade Industrial (I3) —
Junction Temperature Range -40C to +100C —
Core Supply Voltage 0.87 V to 0.93 V —
Speed Grade -3 I4
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Level ng MSL [DATA_NEEDED: MSL rating] —
Tindminan RoHS Compliant —
Wala sa Halogen [DATA_NEEDED: halogen-free claim] —
Family — Stratix IV GX
Logic Elements — 72,600
Logic Array Blocks (LABs/CLBs) — 2,904
Total RAM Bits — 7,564,880
User I/Os — 372
Core Voltage — 0.9 V
Packhaging — 780-BBGA, FC-FBGA (DF29), 29 x 29 mm
Temperature na Operasyon — -40C to +100C (industrial)
Lead-Free / RoHS — Yes (lead free per supplier listings)
Cell Count — 72,600 cells
Maximum Frequency — 717 MHz
Supplier Package Code — FBGA-780 (DF29)

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