EPF10K100EBC356-1X vs EPF10K100ABI356-3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K100EBC356-1X disebabkan oleh Intel dan EPF10K100ABI356-3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EPF10K100ABI356-3 - FLEX 10KA FPGA 100K Gates 356-BGA | Altera
EPF10K100ABI356-3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EPF10K100EBC356-1X | EPF10K100ABI356-3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Series | FLEX 10KE | — |
| Logic Elements | 4,992 | — |
| Typical Gates | 100,000 | 100,000 |
| Logic Array Blocks (LABs) | 624 | 624 |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 49,152 | — |
| User I/O Count | 274 | — |
| Propagation Delay | 0.6 ns | 0.6 ns |
| Logic Family | CMOS | CMOS |
| Core Process Technology | 0.22 um CMOS, 5 metal layers | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Supply Voltage | 3.3 V (multi-volt tolerant to 5 V) | — |
| Suhu Operasi | 0 C to +70 C (Commercial) | 0 C to 70 C |
| Package Type | 356-LBGA (BGA-356) | — |
| Package Dimensions | 35 x 35 mm, 1.27 mm ball pitch | — |
| Speed Grade | -1X | -3 (slowest of three grades) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Configuration Method | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status not stated in source data] |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | FLEX 10KA |
| Logic Elements (LEs) | — | 4992 |
| Embedded Memory (RAM bits) | — | 24576 |
| Maximum User I/Os | — | 274 |
| Kemasan | — | 356-LBGA |
| Process Technology | — | 0.3 um |
| Tegangan Pemberi Arus | — | 3.3 V |
| Maximum Frequency | — | 125 MHz |