EPF10K130EFC484-1 vs EPF10K130EFC484-3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K130EFC484-1 disebabkan oleh Intel dan EPF10K130EFC484-3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EPF10K130EFC484-1 - FLEX-10KE FPGA 130K Gates 484-BGA | Intel / Altera
EPF10K130EFC484-1 ✓ Aktif
Pengandingan Spesifikasi
| Parametr | EPF10K130EFC484-1 | EPF10K130EFC484-3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Harga Unit (USD) | $92.00 | — |
| Series | FLEX-10KE | — |
| Family | FLEX-10KE | FLEX 10KE |
| Typical Gates | 130,000 | — |
| Logic Elements | 6,656 | — |
| Logic Array Blocks (LABs) | 832 | 832 |
| Embedded Memory (EAB) | 65,536 bits (64 Kbit) | — |
| User I/Os | 369 | — |
| Maximum Frequency | 333.33 MHz | — |
| Propagation Delay | 0.6 ns | 0.6 ns (per LE) |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 3.3 V (MultiVolt I/O compatible with 5.0 V tolerant) | — |
| Logic Family | CMOS | CMOS (SRAM-based) |
| Package Type | FineLine BGA-484 | — |
| Package Dimensions | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| Suhu Operasi | 0C to +70C (Commercial) | 0 C to +70 C (commercial) |
| Configuration Interface | JTAG (IEEE 1149.1 / IEEE 1532) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Speed Grade | -1 (slower commercial bin) | -3 |
| Logic Elements (LEs) | — | 6,656 |
| Typical Gate Count | — | 130,000 system gates |
| Embedded Memory (EABs) | — | 16 x 4,096 bits (65,536 bits total) |
| Maximum User I/O | — | 369 |
| Supply Voltage (Core) | — | 3.3 V |
| I/O Voltage Support | — | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) |
| Kemasan | — | 484-pin FBGA (FineLine BGA) |
| Configuration Method | — | SRAM-based, serial or parallel, requires external configuration device |