EPF10K130EFC484-3 vs EPF10K130EFC484-3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K130EFC484-3 disebabkan oleh Intel dan EPF10K130EFC484-3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPF10K130EFC484-3 | EPF10K130EFC484-3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | FLEX 10KE | — |
| Logic Elements (LEs) | 6,656 | — |
| Typical Gate Count | 130,000 system gates | 130000 |
| Logic Array Blocks (LABs) | 832 | — |
| Embedded Memory (EABs) | 16 x 4,096 bits (65,536 bits total) | — |
| Maximum User I/O | 369 | — |
| Supply Voltage (Core) | 3.3 V | — |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) | — |
| Propagation Delay | 0.6 ns (per LE) | — |
| Speed Grade | -3 | -3 (faster timing bin) |
| Suhu Operasi | 0 C to +70 C (commercial) | — |
| Kemasan | 484-pin FBGA (FineLine BGA) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Configuration Method | SRAM-based, serial or parallel, requires external configuration device | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS (SRAM-based) | — |
| Series | — | FLEX-10KE |
| Number of Logic Elements / Cells | — | 6656 |
| Total RAM Bits | — | 65536 |
| Number of I/O | — | 369 |
| Number of LABs/CLBs | — | 832 |
| Number of Embedded Array Blocks (EABs) | — | 72 |
| Operating Temperature Grade | — | Commercial (0C to +70C) |
| Core Voltage | — | 2.5 V |
| Process Technology | — | 0.22 µm CMOS |
| Package Type | — | 484-BBGA (FineLine BGA) |
| Package Dimensions | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |
| Configuration Interface | — | JTAG / PS / PPS / Altera serial |