EPF10K250EBC600-2 vs EPF10K200EBC600-2 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K250EBC600-2 disebabkan oleh Altera dan EPF10K200EBC600-2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Altera
EPF10K250EBC600-2 EPF10K250EBC600-2 - FLEX 10KE FPGA 250K Gates 600-BGA | Altera

EPF10K250EBC600-2 - FLEX 10KE FPGA 250K Gates 600-BGA | Altera

EPF10K250EBC600-2 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EPF10K250EBC600-2 EPF10K200EBC600-2
Merek Altera Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Obsolete
Family FLEX 10KE —
Typical Gates 250,000 —
Usable Gates 152,000 —
Logic Elements (LEs) 12,288 9984
Flip-Flops 12,288 —
Logic Array Blocks (LABs) 80 (8 LEs each) 1248
Embedded Array Blocks (EABs) 4096 (2,048 bits each) —
Embedded Memory Bits 40,960 bits —
Maximum User I/O Pins 488 —
I/O Banks 12 —
PLLs 4 —
Core Supply Voltage 3.3 V —
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL+, SSTL-2, SSTL-3 —
Operating Temperature Grade Commercial —
Kemasan 600-ball FineLine BGA —
Jenis Pemasangan Surface Mount Surface Mount
Configuration Mode PS, PPS, PPA, JTAG —
Process Technology SRAM-based, 0.22 um CMOS 0.30 µm CMOS
Series — FLEX-10KE
Logic Family — CMOS (SRAM-based)
Typical Gate Count — 200,000 gates
Embedded Memory (EAB) — 98304 bits (96 Kbits)
Maximum User I/O — 470 pins
Propagation Delay — 0.4 ns
Tegangan Pemberi Arus — 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O)
I/O Standards — LVTTL, LVCMOS, PCI, GTL+
Package Type — 600-ball BGA (BGA-600)
Package Dimensions — 45 × 45 mm
Ball Pitch — 1.27 mm
Package Height — 1.1 mm max
Suhu Operasi — 0°C to +70°C (Commercial)
Configuration Method — JTAG (IEEE 1149.1), EPC2 serial PROM
Part Status — Obsolete
Status RoHS — unknown

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