EPF10K250EBC600-2 vs EPF10K200EBC600-2 比較

詳細並排比較 EPF10K250EBC600-2 由 Altera 與 EPF10K200EBC600-2 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Altera
EPF10K250EBC600-2 EPF10K250EBC600-2 - FLEX 10KE FPGA 250K Gates 600-BGA | Altera

EPF10K250EBC600-2 - FLEX 10KE FPGA 250K Gates 600-BGA | Altera

EPF10K250EBC600-2 ⚠ 最後購買機會

規格比較

參數 EPF10K250EBC600-2 EPF10K200EBC600-2
品牌 Altera Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 Obsolete
Family FLEX 10KE —
Typical Gates 250,000 —
Usable Gates 152,000 —
Logic Elements (LEs) 12,288 9984
Flip-Flops 12,288 —
Logic Array Blocks (LABs) 80 (8 LEs each) 1248
Embedded Array Blocks (EABs) 4096 (2,048 bits each) —
Embedded Memory Bits 40,960 bits —
Maximum User I/O Pins 488 —
I/O Banks 12 —
PLLs 4 —
Core Supply Voltage 3.3 V —
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL+, SSTL-2, SSTL-3 —
Operating Temperature Grade Commercial —
封裝 600-ball FineLine BGA —
安裝類型 Surface Mount Surface Mount
Configuration Mode PS, PPS, PPA, JTAG —
Process Technology SRAM-based, 0.22 um CMOS 0.30 µm CMOS
Series — FLEX-10KE
Logic Family — CMOS (SRAM-based)
Typical Gate Count — 200,000 gates
Embedded Memory (EAB) — 98304 bits (96 Kbits)
Maximum User I/O — 470 pins
Propagation Delay — 0.4 ns
供應電壓 — 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O)
I/O Standards — LVTTL, LVCMOS, PCI, GTL+
Package Type — 600-ball BGA (BGA-600)
Package Dimensions — 45 × 45 mm
Ball Pitch — 1.27 mm
Package Height — 1.1 mm max
工作溫度 — 0°C to +70°C (Commercial)
Configuration Method — JTAG (IEEE 1149.1), EPC2 serial PROM
Part Status — Obsolete
RoHS 狀態 — unknown

資料表與資源

瀏覽所有產品 建立 BOM 索取報價