EPF10K250EBC600-3 vs EPF10K250EBI600-3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K250EBC600-3 disebabkan oleh Intel dan EPF10K250EBI600-3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EPF10K250EBI600-3 EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel

EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel

EPF10K250EBI600-3 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EPF10K250EBC600-3 EPF10K250EBI600-3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Masa Terakhir Dibeli
Family FLEX 10KE FLEX 10KE
Logic Elements 12,160 LEs 12,160
Typical Gates 250,000 —
Maximum User I/O 470 470
Embedded Array Blocks (EABs) 12 (each 2 Kbits) —
Total Embedded Memory 24 Kbits (RAM) —
PLLs (Phase-Locked Loops) 4 —
Dedicated Clock Inputs 6 —
Speed Grade -3 -3 (fastest)
Core Supply Voltage 3.3 V —
I/O Supply Voltage 3.3 V (5 V tolerant) —
Kemasan 600-ball FineLine BGA 600-ball BGA (HBGA)
Configuration Mode Passive Serial / Passive Parallel / JTAG —
Boundary Scan IEEE 1149.1 (JTAG) —
Suhu Operasi [DATA_NEEDED: operating temperature range] Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range]
Process Technology SRAM-based CMOS 0.22 µm CMOS, 4-layer metal
Typical Gate Count — 250,000 system gates
Embedded System Blocks (ESBs) — 12
Dedicated Inputs — 4
PLLs — 4
On-chip RAM — Up to 40 Kbits
Ball Pitch — 1.93 mm
Core Voltage — 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT]
Configuration Method — SRAM, requires external configuration device (EPC series)
Jenis Pemasangan — Surface Mount
Status RoHS — Not specified (SnPb / tin-lead finish per legacy distributor listing)
Lead-free — no (legacy tin-lead per distributor description)

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