EPF10K250EFI672-3 vs EPF10K200EFC672-3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K250EFI672-3 disebabkan oleh Intel dan EPF10K200EFC672-3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EPF10K250EFI672-3 EPF10K200EFC672-3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Obsolete
Family FLEX 10KE —
Typical Gates 250,000 —
Logic Elements [DATA_NEEDED: exact LE count] —
User I/O Pins 470 —
Embedded Array Blocks (EABs) 12 —
EAB Dual-Port Width Up to 16-bit —
Maximum EAB Memory [DATA_NEEDED: bits per EAB] —
Propagation Delay (tpd) 0.4 ns (typical, -3 speed grade) —
Core Supply Voltage 2.5 V —
I/O Supply Voltage 2.5 V / 3.3 V (multiVolt I/O) —
Kemasan 672-ball FineLine BGA, 1.27 mm pitch —
Process Technology CMOS, SRAM-based configuration 0.22 µm CMOS
Configuration Interface JTAG / ByteBlaster (EPC2/EPC8 PROM) —
Suhu Operasi 0 °C to 70 °C (commercial) 0 °C to +70 °C (commercial)
Design Entry EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog —
Status RoHS Unknown (legacy Altera non-RoHS device) [DATA_NEEDED: rohs status]
Series — FLEX 10KE
Number of Logic Elements / Cells — 9,984
Number of LABs / CLBs — 1248
Total RAM Bits — 98,304 bits (12 EABs of 8 Kbits)
Number of I/O — 470
Number of Gates (typical) — 200,000
Supply Voltage - Operating — 2.3 V to 2.7 V (2.5 V nominal)
Maximum Operating Frequency — 166.67 MHz
Propagation Delay — 0.4 ns
Kemasan / Case — 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
Jenis Pemasangan — Surface Mount
Configuration Memory — SRAM-based (volatile, requires external configuration device)
Number of PLLs — 4
Aras MSL — [DATA_NEEDED: MSL level]
Lead-Free — [DATA_NEEDED: lead-free status]

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