EPF10K30EFC256-3 vs EPF10K30EFC256-1X Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K30EFC256-3 disebabkan oleh Intel dan EPF10K30EFC256-1X disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EPF10K30EFC256-1X - FLEX 10KE FPGA, 30K Gates, 256-BGA | Intel / Altera
EPF10K30EFC256-1X ObsoletePengandingan Spesifikasi
| Parametr | EPF10K30EFC256-3 | EPF10K30EFC256-1X |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 30,000 | 30,000 |
| Logic Elements / Cells | 1,728 | — |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded RAM Bits | 24,576 | — |
| User I/O Pins | 176 | — |
| Maximum Operating Frequency | 200 MHz | — |
| Process Technology | 0.22 micrometer CMOS | 0.22 µm CMOS |
| Core Supply Voltage (VCCINT) | 2.5 V | — |
| I/O Supply Voltage (VCCIO) | 3.3 V (multi-voltage I/O standard support) | — |
| Kemasan | 256-ball FineLine BGA | 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA) |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Speed Grade | -3 (fastest) | -1X (fastest commercial) |
| Temperature Grade | Commercial | — |
| Configuration Interface | Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Logic Elements | — | 1728 |
| Embedded Memory (EAB RAM) | — | 24,576 bits (6 EABs of 4 Kbit each) |
| User I/O | — | 176 |
| Maximum Internal Frequency | — | 250 MHz |
| Propagation Delay (tpd) | — | 0.4 ns to 0.6 ns |
| Core Supply Voltage | — | 2.5 V |
| MultiVolt I/O Support | — | 2.5 V / 3.3 V / 5 V |
| Suhu Operasi | — | 0 °C to +70 °C (commercial) |
| Configuration Method | — | SRAM, JTAG (IEEE 1149.1) |
| Phase-Locked Loops | — | 4 |
| Compliance | — | RoHS (check distributor for specific lot), Pb-free option available |