EPF10K30EFC256-3 vs EPF10K30EFC256-1X Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30EFC256-3 sa pamamagitan ng Intel at EPF10K30EFC256-1X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K30EFC256-3 EPF10K30EFC256-1X
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family FLEX 10KE FLEX 10KE
Typical Gates 30,000 30,000
Logic Elements / Cells 1,728 —
Logic Array Blocks (LABs) 216 216
Embedded RAM Bits 24,576 —
User I/O Pins 176 —
Maximum Operating Frequency 200 MHz —
Process Technology 0.22 micrometer CMOS 0.22 µm CMOS
Core Supply Voltage (VCCINT) 2.5 V —
I/O Supply Voltage (VCCIO) 3.3 V (multi-voltage I/O standard support) —
Packhaging 256-ball FineLine BGA 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA)
Uri ng Pagpapasok Surface Mount (BGA) —
Speed Grade -3 (fastest) -1X (fastest commercial)
Temperature Grade Commercial —
Configuration Interface Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) —
Tindminan RoHS [DATA_NEEDED: RoHS status] —
Logic Elements — 1728
Embedded Memory (EAB RAM) — 24,576 bits (6 EABs of 4 Kbit each)
User I/O — 176
Maximum Internal Frequency — 250 MHz
Propagation Delay (tpd) — 0.4 ns to 0.6 ns
Core Supply Voltage — 2.5 V
MultiVolt I/O Support — 2.5 V / 3.3 V / 5 V
Temperature na Operasyon — 0 °C to +70 °C (commercial)
Configuration Method — SRAM, JTAG (IEEE 1149.1)
Phase-Locked Loops — 4
Compliance — RoHS (check distributor for specific lot), Pb-free option available

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