EPF6024AFC256-3 vs EPF6024AFC256-1 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF6024AFC256-3 disebabkan oleh Intel dan EPF6024AFC256-1 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EPF6024AFC256-3 - 24K Gates 1960 Cells FLEX 6000 FPGA | Intel | BGA-256
EPF6024AFC256-3 Obsolete
Pengandingan Spesifikasi
| Parametr | EPF6024AFC256-3 | EPF6024AFC256-1 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | FLEX 6000 | FLEX 6000 |
| Logic Elements / Cells | 1960 | — |
| Total Gates | 24K | — |
| Maximum Internal Frequency | 172 MHz | 200 MHz |
| Maximum Operating Frequency | 142.86 MHz | — |
| User I/Os | 218 | — |
| Tegangan Pemberi Arus | 3.3 V | — |
| Process Technology | 0.42 umm CMOS | 0.42 µm CMOS, SRAM-based |
| Suhu Operasi | 0C to +85C (commercial) | 0°C to +85°C (commercial) |
| Kemasan | 256-ball FBGA (FineLine BGA) | — |
| Pins / Balls | 256 | — |
| Device Type | FPGA (Field Programmable Gate Array) / SPLD classification in some catalogs | — |
| Configuration Method | SRAM, serial/parallel via MAX+PLUS II or Quartus | SRAM, serial configuration device required |
| Speed Grade | -3 (fastest of three FLEX 6000 commercial grades) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | unknown | [DATA_NEEDED: rohs status] |
| Lead-Free | unknown | [DATA_NEEDED: lead-free status] |
| Supplier Package Code | BGA-256 / FBGA-256 | — |
| Device Logic Elements / Cells | — | 1960 |
| Equivalent Gate Count | — | 24,000 gates |
| Logic Array Blocks (LABs) | — | 196 |
| Number of I/O | — | 219 (218 user I/O pins) |
| Internal Frequency | — | 172 MHz |
| Supply Voltage (Core) | — | 3.3 V |
| Package Type | — | 256-pin FBGA (FineLine BGA) |