EPM2210F256C4 vs EPM2210F256C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM2210F256C4 disebabkan oleh Altera dan EPM2210F256C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EPM2210F256C4 EPM2210F256C3N
Merek Altera Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series MAX II MAX II
Logic Elements 2,210 —
Equivalent Macrocells 1,700 —
User Flash Memory (UFM) 8 Kbits —
User I/O Pins 212 —
Kemasan 256-ball FineLine BGA (FBGA) 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch
Process Technology 0.18 µm 6-layer-metal flash 0.18 um flash CMOS
Core Supply Voltage 1.8 V —
I/O Supply Voltage (MultiVolt) 1.5 V / 1.8 V / 2.5 V / 3.3 V —
Pin-to-pin Delay (tPD1) 7 ns —
Maximum Frequency (fMAX) 201 MHz —
Suhu Operasi 0 °C to +85 °C (commercial extended) —
Programming Interface JTAG (IEEE 1149.1) ISP —
Jenis Pemasangan Surface Mount Surface Mount
Status RoHS Compliant Compliant (per DigiKey product page)
Device Type — CPLD (Complex Programmable Logic Device)
Programmable Type — In System Programmable (JTAG, IEEE 1149.1)
Macrocells — 1700
Logic Elements / Blocks — 2210
Number of User I/Os — 204
Maximum Propagation Delay (tPD) — 7 ns
Maximum Internal Frequency (fMAX) — 304 MHz
Internal Supply Voltage — 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail)
I/O Standard Support — 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt)
User Flash Memory — 8 Kbits
Configuration Memory — On-chip flash (non-volatile, instant-on)
Suhu Hubungan Operasi — 0 C to 85 C (commercial, TJ suffix 'C')
Aras MSL — 3 (per JEDEC J-STD-020, typical for FBGA)

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