EPM2210F324C3N vs EPM2210GF324C5 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM2210F324C3N disebabkan oleh Intel dan EPM2210GF324C5 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EPM2210GF324C5 - MAX II 2210 LE CPLD, 324-BGA, 5ns | Intel/Altera
EPM2210GF324C5 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EPM2210F324C3N | EPM2210GF324C5 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Device Family | MAX II | — |
| Logic Elements (LE) | 2,210 | 2,210 |
| Equivalent Macrocells | 1,700 | 1,700 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Maximum User I/Os | 272 | 272 |
| Pin-to-Pin Delay (tPD1) | 7 ns (commercial speed grade) | 5 ns (C5 speed grade) |
| Global Clock Networks | 4 | — |
| Core Voltage | 1.8 V | — |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Kemasan | FBGA-324 (324-ball FineLine BGA, 19 x 19 mm, 1.0 mm pitch) | 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| Programming Interface | JTAG 1149.1 (in-system programmable, ISP) | — |
| Suhu Operasi | 0C to +85C (commercial) | — |
| Process Technology | 6-layer-metal CMOS, flash-based | 6-layer-metal flash, 0.18 um |
| Status RoHS | Lead-free (per datasheet) | Compliant (lead-free) |
| Design Software | Quartus II / Quartus Prime (Intel FPGA) | — |
| Family | — | MAX II |
| Device Name | — | EPM2210 |
| Internal Performance | — | 304 MHz |
| Core Voltage (VCCINT) | — | 1.8 V |
| I/O Voltage (VCCIO) - MultiVolt | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Suhu Hubungan Operasi | — | 0C to +85C (commercial) |
| In-System Programmability | — | JTAG (IEEE 1149.1) |
| Jenis Pemasangan | — | Surface Mount (BGA) |