EPM2210GF324C5N vs EPM2210GF324C5 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM2210GF324C5N disebabkan oleh Intel dan EPM2210GF324C5 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EPM2210GF324C5 - MAX II 2210 LE CPLD, 324-BGA, 5ns | Intel/Altera
EPM2210GF324C5 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EPM2210GF324C5N | EPM2210GF324C5 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Family | MAX II G | MAX II |
| Series | MAX II | — |
| Logic Elements | 2210 | — |
| Equivalent Macrocells | 1700 | 1,700 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Maximum User I/O | 212 | — |
| Pin-to-Pin Delay (tPD) | 11.2 ns | — |
| Propagation Delay | 11.2 ns (max) | — |
| Technology | Flash CMOS, 6-layer metal | — |
| Core Voltage | 3.3 V / 2.5 V (internal) | — |
| I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| Kemasan | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch | 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm |
| Suhu Operasi | 0 °C to +85 °C (commercial) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Programmability | In-system (JTAG / IEEE 1532), non-volatile | — |
| Lead Free | Yes | — |
| Status RoHS | Compliant | Compliant (lead-free) |
| Aras MSL | 3 | — |
| Device Name | — | EPM2210 |
| Logic Elements (LE) | — | 2,210 |
| Maximum User I/Os | — | 272 |
| Pin-to-Pin Delay (tPD1) | — | 5 ns (C5 speed grade) |
| Internal Performance | — | 304 MHz |
| Core Voltage (VCCINT) | — | 1.8 V |
| I/O Voltage (VCCIO) - MultiVolt | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | — | 6-layer-metal flash, 0.18 um |
| Suhu Hubungan Operasi | — | 0C to +85C (commercial) |
| In-System Programmability | — | JTAG (IEEE 1149.1) |