EPM570F256C3N vs EPM570FGF256I5N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570F256C3N disebabkan oleh Intel dan EPM570FGF256I5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM570F256C3N | EPM570FGF256I5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II |
| Logic Elements (LEs) | 570 | 570 |
| Equivalent Macrocells | 440 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Maximum Operating Frequency | 304 MHz | — |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | 0.18 micron |
| Core Voltage | 2.5 V / 3.3 V | — |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Kemasan | 256-ball FBGA (FineLine BGA) | 256-ball FBGA (FGF256) |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | — |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | — |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | JTAG / ISP |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL level not stated in provided data] | [DATA_NEEDED: MSL level] |
| Status RoHS | Compliant (per DigiKey listing) | Compliant |
| Lead-Free | Yes (per suffix 'N' convention) | — |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | — |
| Device Type | — | CPLD (Complex Programmable Logic Device) |
| Macrocells | — | 440 |
| Propagation Delay (tPD) | — | 5.0 ns |
| User I/O Pins (max) | — | 212 |
| Configuration Memory | — | Internal Flash (non-volatile, instant-on) |
| Tegangan Pemberi Arus | — | 3.3 V core / multi-volt I/O (1.5/1.8/2.5/3.3 V) |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Speed Grade | — | 5 (fast) |
| Suhu Operasi | — | -40C to +100C |