EPM570F256C3N vs EPM570FGF256I5N 比較
詳細並排比較 EPM570F256C3N 由 Intel 與 EPM570FGF256I5N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EPM570F256C3N | EPM570FGF256I5N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | MAX II | MAX II |
| Logic Elements (LEs) | 570 | 570 |
| Equivalent Macrocells | 440 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Maximum Operating Frequency | 304 MHz | — |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | 0.18 micron |
| Core Voltage | 2.5 V / 3.3 V | — |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| 封裝 | 256-ball FBGA (FineLine BGA) | 256-ball FBGA (FGF256) |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | — |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | — |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | JTAG / ISP |
| 安裝類型 | Surface Mount | Surface Mount |
| MSL 等級 | [DATA_NEEDED: MSL level not stated in provided data] | [DATA_NEEDED: MSL level] |
| RoHS 狀態 | Compliant (per DigiKey listing) | Compliant |
| Lead-Free | Yes (per suffix 'N' convention) | — |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | — |
| Device Type | — | CPLD (Complex Programmable Logic Device) |
| Macrocells | — | 440 |
| Propagation Delay (tPD) | — | 5.0 ns |
| User I/O Pins (max) | — | 212 |
| Configuration Memory | — | Internal Flash (non-volatile, instant-on) |
| 供應電壓 | — | 3.3 V core / multi-volt I/O (1.5/1.8/2.5/3.3 V) |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Speed Grade | — | 5 (fast) |
| 工作溫度 | — | -40C to +100C |