EPM570M256C4N vs EPM570GF256C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570M256C4N disebabkan oleh Intel dan EPM570GF256C4N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Altera
EPM570GF256C4N - 570 LEs CPLD, 4ns, 212 I/O, FBGA-256 | Intel / Altera
EPM570GF256C4N ✓ AktifPengandingan Spesifikasi
| Parametr | EPM570M256C4N | EPM570GF256C4N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II G |
| Device Logic Elements | 440 LE | — |
| Macro Cells | 440 | — |
| Maximum User I/Os | 160 | — |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbits |
| Internal Performance (fMAX) | 247.5 MHz | — |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V | — |
| Process Technology | 0.18 µm CMOS | — |
| Configuration Memory | On-chip Flash (non-volatile, instant-on ≤ 0.5 ms) | Flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1), in-system programmable |
| Kemasan | 256-ball Micro FineLine BGA (MBGA), 11 × 11 mm | 256-ball FineLine BGA (FBGA-256) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Suhu Operasi | -40 °C to +125 °C | -40 °C to +125 °C (industrial) |
| Lead-Free / RoHS | Yes, LEAD FREE (per datasheet.com spec listing) | Lead-free, FBGA package |
| Logic Family | CMOS | — |
| Device Series | — | EPM570G |
| Logic Elements (LEs) | — | 570 |
| Macrocells | — | 440 |
| User I/Os | — | 212 |
| Speed Grade | — | C4 (tPD = 4 ns) |
| Pin-to-Pin Delay (tPD) | — | 4 ns |
| Internal fMAX | — | 304 MHz |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 17 x 17 mm |
| Core Voltage | — | 1.8 V |
| I/O Bank Voltages (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |