EPM570M256C4N vs EPM570GF256C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM570M256C4N sa pamamagitan ng Intel at EPM570GF256C4N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EPM570GF256C4N - 570 LEs CPLD, 4ns, 212 I/O, FBGA-256 | Intel / Altera
EPM570GF256C4N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EPM570M256C4N | EPM570GF256C4N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX II | MAX II G |
| Device Logic Elements | 440 LE | — |
| Macro Cells | 440 | — |
| Maximum User I/Os | 160 | — |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbits |
| Internal Performance (fMAX) | 247.5 MHz | — |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V | — |
| Process Technology | 0.18 µm CMOS | — |
| Configuration Memory | On-chip Flash (non-volatile, instant-on ≤ 0.5 ms) | Flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1), in-system programmable |
| Packhaging | 256-ball Micro FineLine BGA (MBGA), 11 × 11 mm | 256-ball FineLine BGA (FBGA-256) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Temperature na Operasyon | -40 °C to +125 °C | -40 °C to +125 °C (industrial) |
| Lead-Free / RoHS | Yes, LEAD FREE (per datasheet.com spec listing) | Lead-free, FBGA package |
| Logic Family | CMOS | — |
| Device Series | — | EPM570G |
| Logic Elements (LEs) | — | 570 |
| Macrocells | — | 440 |
| User I/Os | — | 212 |
| Speed Grade | — | C4 (tPD = 4 ns) |
| Pin-to-Pin Delay (tPD) | — | 4 ns |
| Internal fMAX | — | 304 MHz |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 17 x 17 mm |
| Core Voltage | — | 1.8 V |
| I/O Bank Voltages (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |