H5AN8G8NAFR-RDC vs H5AN8G8NAFR-UHI Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci H5AN8G8NAFR-RDC disebabkan oleh SK hynix dan H5AN8G8NAFR-UHI disebabkan oleh SK hynix. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | H5AN8G8NAFR-RDC | H5AN8G8NAFR-UHI |
|---|---|---|
| Merek | SK hynix | SK hynix |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | — |
| Organisasi | 1G x 8 (x8) | 1G x 8 |
| Antaramuka | DDR4 (Double Data Rate 4) | DDR4 (JEDEC-class) |
| Speed Grade | -RDC (DDR4-2666 class) | — |
| Kadar Data | 2666 MT/s (per -R speed grade suffix) | DDR4-2400 (PC2400), 1200 MHz clock |
| Core Supply Voltage (VDD) | 1.2 V | — |
| I/O Supply Voltage (VDDQ) | 1.2 V | — |
| Wordline Supply (VPP) | 2.5 V | — |
| Banks / Bank Groups | 16 banks / 4 bank groups (DDR4 8Gb architecture) | — |
| Burst Length | 8 (BL8) | — |
| Latensi CAS | [DATA_NEEDED: CAS Latency] | [DATA_NEEDED: CAS latency for UHI speed grade] |
| Kemasan | 78-ball FBGA | 78-ball FBGA |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | [DATA_NEEDED: Operating Temperature range] | [DATA_NEEDED: operating temperature range] |
| Lead-Free | Yes | — |
| Boson Bebas | Yes | — |
| Status RoHS | Compliant | Compliant |
| Datasheet Revision | Rev. 1.2 / Jul. 2017 | — |
| Memory Density | — | 8 Gb |
| Tegangan Pemberi Arus | — | 1.2 V |
| Lead Free | — | Yes |
| Boson Bebas | — | Yes |
| Technology | — | CMOS |
| Application | — | Main memory (high density, high bandwidth) |
| Refresh | — | [DATA_NEEDED: refresh specification] |
| Aras MSL | — | [DATA_NEEDED: moisture sensitivity level] |