H5AN8G8NAFR-RDC vs H5AN8G8NAFR-UHI Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng H5AN8G8NAFR-RDC sa pamamagitan ng SK hynix at H5AN8G8NAFR-UHI sa pamamagitan ng SK hynix. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | H5AN8G8NAFR-RDC | H5AN8G8NAFR-UHI |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | — |
| Organisasyon | 1G x 8 (x8) | 1G x 8 |
| Interface | DDR4 (Double Data Rate 4) | DDR4 (JEDEC-class) |
| Speed Grade | -RDC (DDR4-2666 class) | — |
| Rate ng Data | 2666 MT/s (per -R speed grade suffix) | DDR4-2400 (PC2400), 1200 MHz clock |
| Core Supply Voltage (VDD) | 1.2 V | — |
| I/O Supply Voltage (VDDQ) | 1.2 V | — |
| Wordline Supply (VPP) | 2.5 V | — |
| Banks / Bank Groups | 16 banks / 4 bank groups (DDR4 8Gb architecture) | — |
| Burst Length | 8 (BL8) | — |
| Latensya ng CAS | [DATA_NEEDED: CAS Latency] | [DATA_NEEDED: CAS latency for UHI speed grade] |
| Packhaging | 78-ball FBGA | 78-ball FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | [DATA_NEEDED: Operating Temperature range] | [DATA_NEEDED: operating temperature range] |
| Lead-Free | Yes | — |
| Wala sa Halogen | Yes | — |
| Tindminan RoHS | Compliant | Compliant |
| Datasheet Revision | Rev. 1.2 / Jul. 2017 | — |
| Memory Density | — | 8 Gb |
| Volte ng Pagbibigay | — | 1.2 V |
| Lead Free | — | Yes |
| Wala sa Halogen | — | Yes |
| Technology | — | CMOS |
| Application | — | Main memory (high density, high bandwidth) |
| Refresh | — | [DATA_NEEDED: refresh specification] |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |