K4AAG165WM-BCRC vs H5ANAG8NCMR-VKC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4AAG165WM-BCRC disebabkan oleh Samsung Electronics dan H5ANAG8NCMR-VKC disebabkan oleh SK hynix. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Samsung Electronics
K4AAG165WM-BCRC - 16Gb DDR4 x16 SDRAM 3200Mbps | Samsung
K4AAG165WM-BCRC ✓ Aktif
Pengandingan Spesifikasi
| Parametr | K4AAG165WM-BCRC | H5ANAG8NCMR-VKC |
|---|---|---|
| Merek | Samsung Electronics | SK hynix |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gb | — |
| Organisasi | 1G x 16 | — |
| Kadar Data | 3200 Mbps | 2666 Mbps/pin (DDR4-2666) |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| Antaramuka | DDR4 (SSTL-12) | — |
| Kemasan | 96-ball FBGA | FBGA-78 |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | — |
| Dynamic On-Chip Termination | Yes | — |
| Data Mask Function | Yes | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range for K4AAG165WM-BCRC] | [DATA_NEEDED: operating temperature range] |
| CAS Latency (CL) | [DATA_NEEDED: CAS latency at 3200 Mbps] | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Saiz Ingatan | — | 16 Gb |
| Memory Organization | — | 2G x 8 |
| I/O Voltage (VDDQ) | — | 1.2 V |
| Speed Grade | — | VK (per SK hynix speed-bin suffix) |
| Power Class | — | Normal Power |
| Bank Groups | — | 4 |
| Banks Total | — | 16 |
| Latensi CAS | — | [DATA_NEEDED: CAS latency for VK speed bin] |
| Packaging | — | [DATA_NEEDED: standard packing quantity] |
| Manufacturer Process | — | CMOS DRAM |