K4B4G1646D-BYK0 vs K4B4G1646D-BYMA0 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4B4G1646D-BYK0 disebabkan oleh Samsung Electronics dan K4B4G1646D-BYMA0 disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Samsung Electronics
K4B4G1646D-BYMA0 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung
K4B4G1646D-BYMA0 ✓ AktifPengandingan Spesifikasi
| Parametr | K4B4G1646D-BYK0 | K4B4G1646D-BYMA0 |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR3L SDRAM | DDR3L SDRAM |
| Density | 4 Gbit | — |
| Organisasi | 256M x 16 | 256M x 16 |
| Tegangan Pemberi Arus | 1.35 V (1.5 V compatible) | 1.35 V |
| Kadar Data | 1600 Mbps (PC3-12800) | 1866 Mbps (PC3-14900) |
| Kemasan | 96-ball FBGA | 96-ball FBGA |
| Suhu Operasi | 0°C to 85°C | — |
| Latensi CAS | Programmable (e.g., 11, 10, 9) | — |
| Burst Length | 8 (with burst chop 4) | — |
| On-Die Termination | Yes | — |
| Lead-Free | Yes | Yes |
| Boson Bebas | Yes | Yes |
| RoHS Compliant | Yes | Yes |
| Bilangan Pin | 96 | — |
| Die Revision | D-die | — |
| Total Memory Size | — | 4 Gb |
| Gambaran Suhu Operasi | — | 0°C to +85°C |
| Auto Precharge | — | Supported |
| Asynchronous Reset | — | Supported |
| ZQ Calibration | — | Supported |
| Data Mask | — | Supported |
| Dynamic On-Chip Termination | — | Supported |