LCMXO3LF-6900C-5BG256C vs LFE2-6E-5F256C Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci LCMXO3LF-6900C-5BG256C disebabkan oleh Lattice Semiconductor dan LFE2-6E-5F256C disebabkan oleh Lattice Semiconductor. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Lattice Semiconductor
LCMXO3LF-6900C-5BG256C - 6864-LUT MachXO3LF FPGA | Lattice
LCMXO3LF-6900C-5BG256C ✓ AktifLattice Semiconductor
LFE2-6E-5F256C - 6K Lattice ECP2 FPGA, 190 I/O | Lattice
LFE2-6E-5F256C UnknownPengandingan Spesifikasi
| Parametr | LCMXO3LF-6900C-5BG256C | LFE2-6E-5F256C |
|---|---|---|
| Merek | Lattice Semiconductor | Lattice Semiconductor |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Unknown |
| Device Type | MachXO3LF field-programmable gate array (FPGA) | ECP2 Field Programmable Gate Array (FPGA) |
| Logic Elements | 6,864 LUTs | 6,000 cells |
| Embedded Memory | 240 Kbits | — |
| I/O Count | 206 I/Os | — |
| Tegangan Pemberi Arus | 2.5 V and 3.3 V | 1.14 V to 1.26 V |
| Kemasan | 256-LFBGA | 256-pin FBGA, 17 x 17 mm |
| Package Type | BGA-256 | FBGA |
| Speed Grade | Slow grade | — |
| Temperature Grade | Commercial | — |
| Configuration | Non-volatile, instant-on FPGA | — |
| I/O Signaling | MIPI, LVDS, and sub-LVDS support identified in verified data | — |
| Programmable Logic | FPGA LUT-based programmable logic | — |
| Embedded RAM Type | Embedded block RAM | — |
| Development Support | MachXO3LF Starter Kit supported | — |
| Configuration Memory Support | SPI Flash external boot and dual-boot evaluation support | — |
| Jenis Pemasangan | Surface mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| Logic Array Blocks | — | 750 LABs |
| User I/O | — | 190 pins |
| Total RAM | — | 56,320 bits |
| Nominal Supply Class | — | 1.2 V |
| Suhu Hubungan Operasi | — | 0°C to 85°C |
| Process Technology | — | 90 nm |
| Number of Package Pins | — | 256 pins |
| DSP Capability | — | Advanced DSP blocks |
| SERDES Capability | — | [DATA_NEEDED: LFE2-6E-5F256C-specific SERDES capability] |
| Programming Configuration | — | [DATA_NEEDED: configuration memory and programming interface] |