M1AFS1500-1FGG256I vs M1AFS1500-FG256K Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M1AFS1500-1FGG256I disebabkan oleh Microchip Technology dan M1AFS1500-FG256K disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
M1AFS1500-1FGG256I - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS1500-1FGG256I ✓ AktifMicrochip Technology
M1AFS1500-FG256K - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS1500-FG256K ✓ AktifPengandingan Spesifikasi
| Parametr | M1AFS1500-1FGG256I | M1AFS1500-FG256K |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Fusion (M1 series, mixed-signal FPGA) | Fusion (M1 - ARM Cortex-M1 enabled) |
| System Gates | 1.5 million | 1500000 |
| Processor Core | ARM Cortex-M1 (soft core in fabric) | — |
| User I/O | 119 | 119 |
| Flash Configuration Memory | 276480 bits | — |
| Logic Cells | 38400 | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm flash-based | — |
| Kemasan | 256-LBGA (FBGA), 17x17 mm, 1.0 mm ball pitch | 256-LBGA (FBGA/FG256) |
| Suhu Operasi | -40C to +85C (industrial, I suffix) | [DATA_NEEDED: operating temperature range for FG256K suffix] |
| Speed Grade | -1 (standard) | Standard (no dash letter suffix) |
| Configuration Type | Flash-based, instant-on, single chip | — |
| Security | 128-bit flash lock, AES decryption | — |
| Analog Features | Configurable analog blocks (mixed-signal) | — |
| Clock Management | Integrated CCC (clock conditioning circuits) | Integrated clock generation and management circuitry |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Flash Memory Cells | — | 276480 |
| Embedded Processor | — | ARM Cortex-M1 |
| Tegangan Pemberi Arus | — | 1.425 V to 1.575 V |
| Core Process Technology | — | 130 nm flash |
| Packaging | — | Tray |
| Configuration Memory | — | On-chip flash (live at power-up) |
| Analog Peripherals | — | Integrated configurable analog blocks |