M29F800FB55N3F2 vs M29F400FB55N3F2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M29F800FB55N3F2 disebabkan oleh Micron Technology dan M29F400FB55N3F2 disebabkan oleh Micron Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Micron Technology
M29F800FB55N3F2 - 8Mbit 5V Parallel NOR Flash 55ns | Micron
M29F800FB55N3F2 ✓ AktifPengandingan Spesifikasi
| Parametr | M29F800FB55N3F2 | M29F400FB55N3F2 |
|---|---|---|
| Merek | Micron Technology | Micron Technology |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Memory Density | 8389 kbits (8 Mbit) | — |
| Organisasi | 1M x 8 / 512K x 16 | 256K x 16 / 512K x 8 |
| Tegangan Pemberi Arus | 5 V | 5 V |
| Access Time | 55 ns | 55 ns |
| Jenis Antaramuka | Parallel NOR | — |
| Boot Block Architecture | Bottom Boot Block | — |
| Program/Erase Controller | Embedded byte/word program algorithms | Embedded byte/word program algorithms |
| Suhu Operasi | -40C to +125C | -40C to +125C |
| Temperature Grade | Automotive (AEC-Q100) | — |
| Package Type | 48-pin TSOP1 | — |
| Package Shape | Rectangular (JESD designation TSOP1) | — |
| Terminal Count | 48 | — |
| JESD-609 Termination Code | e3 (lead-free) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (T/R) | — |
| Status RoHS | Compliant (lead-free terminations) | Compliant (lead-free build per F2 suffix) |
| Jenis Ingatan | — | NOR Flash |
| Density | — | 4 Mbit (4194 kbit) |
| Antaramuka | — | Parallel |
| Boot Block | — | Bottom boot block |
| Kemasan | — | 48-TSOP I |
| Standard Package Quantity | — | 1500 units (Tape & Reel) |
| Active/Standby Current | — | [DATA_NEEDED: active and standby current] |
| Erase/Program Endurance | — | [DATA_NEEDED: endurance cycles] |
| Data Retention | — | [DATA_NEEDED: retention years] |
| VIO Range | — | [DATA_NEEDED: I/O voltage range] |