M7AFS600-1FGG256 vs M7AFS600-1FGG256I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M7AFS600-1FGG256 disebabkan oleh Microchip Technology dan M7AFS600-1FGG256I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
M7AFS600-1FGG256 - Fusion 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-1FGG256 NrndMicrochip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ AktifPengandingan Spesifikasi
| Parametr | M7AFS600-1FGG256 | M7AFS600-1FGG256I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Fusion (Mixed-Signal FPGA) | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 600K | 600K |
| Fabric Elements (Registers) | 110592 | — |
| Embedded Processor | 32-bit ARM CoreMP7 (hard core) | — |
| Speed Grade | -1 | -1 |
| Process Technology | 130 nm flash | 130 nm, 7-layer metal flash-based CMOS |
| Core Supply Voltage | 1.5 V | — |
| Kemasan | 256-LBGA (FPBGA-256, 17x17 mm) | — |
| Jenis Pemasangan | Surface Mount | — |
| Configuration | Flash-based, nonvolatile, live at power-up | — |
| Suhu Operasi | 0C to +70C (commercial) | — |
| Maximum Frequency | [DATA_NEEDED: maximum fabric/system frequency] | — |
| Number of I/O | [DATA_NEEDED: user I/O count for FGG256] | 119 |
| Analog Peripherals | [DATA_NEEDED: ADC channel count and resolution] | — |
| On-chip RTC / POR | [DATA_NEEDED: RTC/POR availability details] | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Processor Core | — | ARM CoreMP7 |
| Tegangan Pemberi Arus Operasi | — | 1.5 V |
| Configuration Memory | — | Flash (nonvolatile) |
| System Performance | — | Up to 350 MHz |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Kemasan / Case | — | 256-Ball FBGA (FGG256) |
| Gaya Pemasangan | — | SMD/SMT |
| Packaging | — | Tray |
| Series | — | M7AFS600 |
| Live at Power-Up (LAPU) | — | Yes |
| Analog Subsystem | — | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) |