M7AFS600-FGG256I vs AFS600-1FG256I Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci M7AFS600-FGG256I disebabkan oleh Microchip Technology dan AFS600-1FG256I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Microchip Technology
M7AFS600-FGG256I M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I ✓ Aktif
Microchip Technology
AFS600-1FG256I AFS600-1FG256I - 600K-Gate Fusion Mixed-Signal FPGA | Microchip

AFS600-1FG256I - 600K-Gate Fusion Mixed-Signal FPGA | Microchip

AFS600-1FG256I ✓ Aktif

Pengandingan Spesifikasi

Parametr M7AFS600-FGG256I AFS600-1FG256I
Merek Microchip Technology Microchip Technology
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Fusion Mixed-Signal FPGA —
System Gates 600K 600,000 gates
User I/O 119 —
Kemasan 256-LBGA (FBGA), 1 mm ball pitch 256-LBGA, 1 mm pitch
Core Voltage 1.5 V —
Process Technology 130 nm 130 nm CMOS
Maximum System Frequency 1098.9 MHz (per distributor parametric listing) —
Embedded Processor ARM CoreMP7 —
Fabric Type Flash-based, non-volatile, instant-on —
Analog Subsystem Integrated configurable analog (per Microchip Fusion family page) —
On-chip Flash Memory Yes (large flash memory blocks, per Microchip Fusion family page) —
Clock Management Integrated clock generation and management circuitry (PLLs) —
Temperature Grade Industrial (I suffix) —
Gambaran Suhu Operasi -40C to +85C (industrial grade standard range) —
Jenis Pemasangan Surface Mount —
Packaging Tray —
Aras MSL [DATA_NEEDED: MSL Level] —
Thermal Resistance (theta_JA) [DATA_NEEDED: Thermal Resistance] —
Device Type — Fusion mixed-signal field-programmable gate array (FPGA)
Logic Family — Flash-based CMOS
I/O Count — 119 I/O
Tegangan Pemberi Arus — 1.5 V
Metal Layers — 7 layers
Kiraan Pin — 256 pins
Suhu Operasi — 0°C to 85°C
Configuration Memory — Nonvolatile flash
Power-Up Behavior — Live at power-up (LAPU)
Integrated Resources — Configurable analog, large flash memory blocks, clock generation and management
Programmable Logic — High-performance flash-based programmable logic
RoHS Compliance — [DATA_NEEDED: RoHS compliance status]
REACH Compliance — [DATA_NEEDED: REACH compliance status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]
Junction Test Temperature — 100°C

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