M7AFS600-FGG256I vs AFS600-1FG256I Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng M7AFS600-FGG256I sa pamamagitan ng Microchip Technology at AFS600-1FG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
M7AFS600-FGG256I M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I ✓ Nakahanda
Microchip Technology
AFS600-1FG256I AFS600-1FG256I - 600K-Gate Fusion Mixed-Signal FPGA | Microchip

AFS600-1FG256I - 600K-Gate Fusion Mixed-Signal FPGA | Microchip

AFS600-1FG256I ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro M7AFS600-FGG256I AFS600-1FG256I
Brand Microchip Technology Microchip Technology
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Fusion Mixed-Signal FPGA —
System Gates 600K 600,000 gates
User I/O 119 —
Packhaging 256-LBGA (FBGA), 1 mm ball pitch 256-LBGA, 1 mm pitch
Core Voltage 1.5 V —
Process Technology 130 nm 130 nm CMOS
Maximum System Frequency 1098.9 MHz (per distributor parametric listing) —
Embedded Processor ARM CoreMP7 —
Fabric Type Flash-based, non-volatile, instant-on —
Analog Subsystem Integrated configurable analog (per Microchip Fusion family page) —
On-chip Flash Memory Yes (large flash memory blocks, per Microchip Fusion family page) —
Clock Management Integrated clock generation and management circuitry (PLLs) —
Temperature Grade Industrial (I suffix) —
Hanay ng Temperature na Operasyon -40C to +85C (industrial grade standard range) —
Uri ng Pagpapasok Surface Mount —
Packaging Tray —
Level ng MSL [DATA_NEEDED: MSL Level] —
Thermal Resistance (theta_JA) [DATA_NEEDED: Thermal Resistance] —
Device Type — Fusion mixed-signal field-programmable gate array (FPGA)
Logic Family — Flash-based CMOS
I/O Count — 119 I/O
Volte ng Pagbibigay — 1.5 V
Metal Layers — 7 layers
Bilang ng Pin — 256 pins
Temperature na Operasyon — 0°C to 85°C
Configuration Memory — Nonvolatile flash
Power-Up Behavior — Live at power-up (LAPU)
Integrated Resources — Configurable analog, large flash memory blocks, clock generation and management
Programmable Logic — High-performance flash-based programmable logic
RoHS Compliance — [DATA_NEEDED: RoHS compliance status]
REACH Compliance — [DATA_NEEDED: REACH compliance status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]
Junction Test Temperature — 100°C

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