MC68EN360VR33L vs MC68EN360VR25L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC68EN360VR33L disebabkan oleh NXP Semiconductors dan MC68EN360VR25L disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC68EN360VR33L - 33MHz M683xx QUICC CPU32+ MPU, 357-PBGA | NXP
MC68EN360VR33L ✗ Akhir HayatPengandingan Spesifikasi
| Parametr | MC68EN360VR33L | MC68EN360VR25L |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | NRND |
| Processor Type | M683xx 32-bit CPU32+ | — |
| Core Architecture | CPU32+ with QUICC RISC communications engine | M68000 (32-bit) |
| Core Count | 1 | — |
| Bus Speed / Operating Frequency | 33 MHz | — |
| Lebar Bus Data | 32-bit | 32-bit |
| Address Bus Width | 32-bit (4 GB space) | — |
| Tegangan Pemberi Arus | 5 V | — |
| Ethernet MAC | Integrated 10/100 Ethernet (MII interface) - 'EN' suffix | — |
| Serial Communication Channels (SCC) | 4 (per QUICC engine) | — |
| DMA Channels | 2 (per QUICC engine) | — |
| Timers | 4 general-purpose 16-bit timers | — |
| DRAM Controller | Integrated, supports FPM/EDO DRAM | — |
| Interrupt Controller | Integrated, programmable priority | — |
| Kemasan | 357-Ball PBGA, 25x25 mm, 1.27 mm pitch ('VR') | 357-PBGA (25x25 mm) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Suhu Operasi | -40C to +85C (industrial) | — |
| Instruction Set | M68k (CPU32+) binary-compatible | — |
| Packaging | Tray | — |
| Lead Free / RoHS | Lead Free / RoHS Compliant | — |
| Process Technology | 0.57 um CMOS (per Freescale datasheet) | — |
| Manufacturer | — | NXP Semiconductors |
| Manufacturer Legacy | — | Freescale Semiconductor / Motorola |
| Part Family | — | MC68300 (QUICC) |
| Processor Core | — | CPU32+ |
| Frekuensi Klock Maksimum | — | 25 MHz |
| Number of Cores | — | 1 |
| Communications Processor Module (CPM) | — | Yes, integrated |
| On-chip Ethernet | — | Yes (10 Mbps Ethernet MAC) |
| On-chip HDLC Channels | — | Multiple (per CPM) |
| Temperature Grade | — | Commercial |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |
| Lead Time (Heisener) | — | Aug 3 - Aug 8 |