MC68EN360VR33L vs MC68EN360VR25L 比較
詳細並排比較 MC68EN360VR33L 由 NXP Semiconductors 與 MC68EN360VR25L 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC68EN360VR33L - 33MHz M683xx QUICC CPU32+ MPU, 357-PBGA | NXP
MC68EN360VR33L ✗ 停產規格比較
| 參數 | MC68EN360VR33L | MC68EN360VR25L |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 停產終止 | NRND |
| Processor Type | M683xx 32-bit CPU32+ | — |
| Core Architecture | CPU32+ with QUICC RISC communications engine | M68000 (32-bit) |
| Core Count | 1 | — |
| Bus Speed / Operating Frequency | 33 MHz | — |
| 資料匯流排寬度 | 32-bit | 32-bit |
| Address Bus Width | 32-bit (4 GB space) | — |
| 供應電壓 | 5 V | — |
| Ethernet MAC | Integrated 10/100 Ethernet (MII interface) - 'EN' suffix | — |
| Serial Communication Channels (SCC) | 4 (per QUICC engine) | — |
| DMA Channels | 2 (per QUICC engine) | — |
| Timers | 4 general-purpose 16-bit timers | — |
| DRAM Controller | Integrated, supports FPM/EDO DRAM | — |
| Interrupt Controller | Integrated, programmable priority | — |
| 封裝 | 357-Ball PBGA, 25x25 mm, 1.27 mm pitch ('VR') | 357-PBGA (25x25 mm) |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| 工作溫度 | -40C to +85C (industrial) | — |
| Instruction Set | M68k (CPU32+) binary-compatible | — |
| Packaging | Tray | — |
| Lead Free / RoHS | Lead Free / RoHS Compliant | — |
| Process Technology | 0.57 um CMOS (per Freescale datasheet) | — |
| Manufacturer | — | NXP Semiconductors |
| Manufacturer Legacy | — | Freescale Semiconductor / Motorola |
| Part Family | — | MC68300 (QUICC) |
| Processor Core | — | CPU32+ |
| 最大時脈頻率 | — | 25 MHz |
| Number of Cores | — | 1 |
| Communications Processor Module (CPM) | — | Yes, integrated |
| On-chip Ethernet | — | Yes (10 Mbps Ethernet MAC) |
| On-chip HDLC Channels | — | Multiple (per CPM) |
| Temperature Grade | — | Commercial |
| RoHS 狀態 | — | [DATA_NEEDED: RoHS status] |
| Lead Time (Heisener) | — | Aug 3 - Aug 8 |