MC8641VU1500KE vs MC8641VU1333JE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC8641VU1500KE disebabkan oleh NXP Semiconductors dan MC8641VU1333JE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC8641VU1500KE - PowerPC e600 MPU, 1.5GHz, 994-FCCBGA | NXP
MC8641VU1500KE ObsoleteNXP Semiconductors
MC8641VU1333JE - PowerPC e600 MPU 1.333GHz 994-FCCBGA | NXP
MC8641VU1333JE ✓ AktifPengandingan Spesifikasi
| Parametr | MC8641VU1500KE | MC8641VU1333JE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | Aktif |
| Core Processor | PowerPC e600 | — |
| Number of Cores | 1 | — |
| Lebar Bus Data | 32-bit | 32-bit |
| Maximum Core Frequency | 1.5 GHz | 1.333 GHz |
| Supply Voltage (Core) | 1.05 V | — |
| Supply Voltage (I/O) | 1.1 V / 1.8 V / 2.5 V / 3.3 V | — |
| RAM Controllers | DDR1, DDR2 (with ECC) | — |
| Ethernet | 4 x 10/100/1000 Mbps MAC | Dual Gigabit Ethernet MAC |
| PCI Express | Dual x4 PCIe endpoints | Yes (dual controllers) |
| Serial RapidIO | Yes | — |
| AltiVec SIMD Engine | Yes (128-bit) | — |
| Cryptographic Acceleration | AES, DES/3DES, RSA, ECC | — |
| Kemasan | 994-FCCBGA (33x33 mm), ceramic flip-chip | 994-FCCBGA (33 x 33 mm) |
| Kiraan Pin | 1023 (effective BGA balls) | — |
| Suhu Operasi | 0°C to +105°C | 0 C to +105 C |
| Status RoHS | RoHS compliant (ceramic BGA) | [DATA_NEEDED: RoHS status] |
| Process Technology | 90 nm CMOS | — |
| Core Architecture | — | PowerPC e600 |
| Series | — | MPC86xx |
| Core Count | — | 1 |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| L2 Cache | — | 1 MB (backside) |
| SIMD Engine | — | AltiVec |
| Core Voltage | — | 1.05 V |
| Memory Controller | — | DDR1/DDR2 with ECC |
| Serial RapidIO (SRIO) | — | Yes |
| Local Bus / MPX | — | 533 MHz |
| Silicon Revision | — | Rev 3.0 (G8) |
| Jenis Pemasangan | — | Surface Mount (Flip-Chip BGA) |