MC9S08GW32CLH vs MC9S08DV128CLH Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08GW32CLH disebabkan oleh NXP Semiconductors dan MC9S08DV128CLH disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC9S08GW32CLH - S08GW 8-bit MCU, 32KB Flash, 64-LQFP | NXP
MC9S08GW32CLH ⚠ Bahagian terakhir untuk beliNXP Semiconductors
MC9S08DV128CLH - 8-Bit 40MHz HCS08 MCU 128KB Flash 64-LQFP | NXP
MC9S08DV128CLH ✓ AktifPengandingan Spesifikasi
| Parametr | MC9S08GW32CLH | MC9S08DV128CLH |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Core Processor | S08 (8-bit) | — |
| Core Size | 8-bit | — |
| Program Memory Size | 32 KB (32K x 8) FLASH | 128 KB (128K x 8) Flash |
| CPU Speed | 20 MHz | — |
| Kemasan | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Gambaran Suhu Operasi | -40C to +85C (TA) | [DATA_NEEDED: temperature grade] |
| ADCs | Two 16-bit SAR ADCs | — |
| Connectivity | I2C, LINbus, SCI (UART), SPI | — |
| Peripherals | LCD driver, PWM, WDT, programmable delay block | — |
| Number of I/O (approx.) | [DATA_NEEDED: exact I/O count] | — |
| Series | S08GW | — |
| ROM/RAM Size | [DATA_NEEDED: RAM size] | — |
| Supply Voltage Range | [DATA_NEEDED: VDD range] | — |
| Status RoHS | Compliant (per DigiKey listing) | Compliant |
| Aras MSL | [DATA_NEEDED: MSL] | — |
| Core Architecture | — | HCS08 (enhanced S08 core) |
| Lebar Bus Data | — | 8-bit |
| CPU Frequency | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| RAM Size | — | 6 KB (6K x 8) |
| Number of I/O Pins | — | 53 |
| Oscillator Type | — | External |
| Tegangan Pemberi Arus Operasi | — | [DATA_NEEDED: Vdd range] |
| Instruction Set | — | HC08 with BGND addition |
| Interrupt Sources | — | Up to 32 |
| Integrated CAN Module | — | Yes (CAN 2.0) |
| Packaging | — | Tray |