MC9S08LH36CLK vs S9S12GN16F1VLC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08LH36CLK disebabkan oleh NXP Semiconductors dan S9S12GN16F1VLC disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MC9S08LH36CLK | S9S12GN16F1VLC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Frequency | 40 MHz | 25 MHz |
| Bus Frequency (per distributor listing) | 16 MHz | — |
| Flash Memory | 36 KB (36K x 8) | — |
| Supply Voltage Range | 2.1 V to 3.6 V | — |
| Number of I/O | 37 | — |
| Kemasan | 80-LQFP (14 x 14 mm) | 32-LQFP (7x7 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Program Memory Type | FLASH | — |
| Operating Voltage at Reduced Speed | 2.1 V (up to 20 MHz, per family datasheet) | — |
| Lifecycle Stage | ACTIVE (per parametric source) | — |
| Status RoHS | RoHS Compliant | Compliant |
| Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| Peripherals | [DATA_NEEDED: peripheral set detail] | — |
| Package Body Dimensions | 14 mm x 14 mm | — |
| Core Architecture | — | HCS12 (16-bit CISC) |
| Program Memory (Flash) | — | 16 KB |
| RAM | — | 2 KB |
| Operating Voltage | — | 3.3 V / 5 V |
| Gambaran Suhu Operasi | — | -40 C to +105 C |
| Communication Interfaces | — | CAN, LIN/SAE J2602, SCI, SPI, I2C |
| ADC | — | 10-bit |
| Timer Module | — | 8-channel TIM (PWM/capture/compare) |
| Automotive Qualification | — | AEC-Q100 |
| Debug Interface | — | BDM (Background Debug Mode) |
| Flash ECC | — | Yes |