MC9S08PA16VTJ vs MC9S08QD4CSC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08PA16VTJ disebabkan oleh NXP Semiconductors dan MC9S08QD4CSC disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MC9S08PA16VTJ | MC9S08QD4CSC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Akhir Hidup |
| Core Architecture | HCS08L (S08 family) | — |
| Lebar Bus Data | 8 bit | — |
| Program Memory (Flash) | 16 KB | — |
| RAM | [DATA_NEEDED: RAM size in KB] | 256 B |
| EEPROM (emulated) | Yes (in flash, configurable) | — |
| Maximum Bus Frequency | 20 MHz | — |
| Supply Voltage (VDD) | 2.7 V to 5.5 V | — |
| Suhu Operasi | -40 C to +105 C | [DATA_NEEDED: operating temperature range] |
| Kemasan | 20-pin TSSOP | 8-SOIC |
| Jenis Pemasangan | Surface Mount (TSSOP) | Surface Mount |
| I/O Pins | Up to 18 GPIO | — |
| ADC | On-chip SAR ADC (channel count [DATA_NEEDED: ADC channels]) | — |
| Analog Comparator | Yes | — |
| Timers | FlexTimer (PWM-capable, channel count [DATA_NEEDED: PWM channels]) | — |
| Interrupts | Up to 40 sources, 4-level nested | — |
| Low-Power Modes | Wait, Stop (low-power) | — |
| Debug Interface | BDM (Background Debug Mode) | Background debugging system (single-wire BDM) |
| Watchdog | COP watchdog | — |
| Status RoHS | Compliant | — |
| Lead-Free / MSL | Lead-free; MSL [DATA_NEEDED: MSL level] | — |
| Tube Packaging Standard Qty | Per tube (qty [DATA_NEEDED: tube qty]) | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Frekuensi Klock Maksimum | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| Tegangan Pemberi Arus | — | 3.3 V / 5 V |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tube |
| Life Cycle Stage | — | End of Life (per NXP product page) |