MC9S12DT256MPVE vs MC9S12KT256MPVE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12DT256MPVE disebabkan oleh NXP Semiconductors dan MC9S12KT256MPVE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE Nrnd
Pengandingan Spesifikasi
| Parametr | MC9S12DT256MPVE | MC9S12KT256MPVE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core | HCS12 (16-bit CISC) | — |
| Maximum CPU Frequency | 25 MHz | — |
| Program Memory (Flash) | 256 KB | — |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| Lebar Bus Data | 16-bit | — |
| Tegangan Pemberi Arus | 2.35 V to 2.75 V (regulated core) | 2.5 V / 3.3 V / 5 V |
| I/O Pins | 91 | — |
| ADC | 2 x 10-bit, 8 channels each (16 channels total) | 2 x 8-channel, 10-bit |
| Timers | 8-channel Enhanced Capture Timer (ECT) | — |
| Communication Interfaces | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) | — |
| Kemasan | 112-LQFP (20x20 mm) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | -40C to +125C (automotive grade) | — |
| Debug Interface | Background Debug Mode (BDM) + JTAG | — |
| Status RoHS | Compliant | Compliant |
| Status Lingkungan Hidup | NRND (Not Recommended for New Designs) | — |
| Series | — | HCS12 |
| Core Processor | — | HCS12 (CPU12, 16-bit) |
| Core Size | — | 16-Bit |
| Speed | — | 25 MHz |
| Program Memory Size | — | 256 KB (256K x 8) Flash |
| RAM Size | — | 12 KB |
| EEPROM Size | — | 4 KB |
| Number of I/O | — | 91 |
| Oscillator Type | — | Internal |
| Connectivity | — | CAN, I2C, SCI, SPI |
| Peripherals | — | PWM, WDT, ADC, IC/OC timer |
| Kemasan / Case | — | 112-LQFP (20 x 20 mm) |
| Packaging | — | Tray |
| Temperature Grade | — | Automotive grade |