MC9S12DT256MPVE vs MC9S12KT256MPVE 比較
詳細並排比較 MC9S12DT256MPVE 由 NXP Semiconductors 與 MC9S12KT256MPVE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE Nrnd
規格比較
| 參數 | MC9S12DT256MPVE | MC9S12KT256MPVE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | 啟用中 |
| Core | HCS12 (16-bit CISC) | — |
| Maximum CPU Frequency | 25 MHz | — |
| Program Memory (Flash) | 256 KB | — |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| 資料匯流排寬度 | 16-bit | — |
| 供應電壓 | 2.35 V to 2.75 V (regulated core) | 2.5 V / 3.3 V / 5 V |
| I/O Pins | 91 | — |
| ADC | 2 x 10-bit, 8 channels each (16 channels total) | 2 x 8-channel, 10-bit |
| Timers | 8-channel Enhanced Capture Timer (ECT) | — |
| Communication Interfaces | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) | — |
| 封裝 | 112-LQFP (20x20 mm) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | -40C to +125C (automotive grade) | — |
| Debug Interface | Background Debug Mode (BDM) + JTAG | — |
| RoHS 狀態 | Compliant | Compliant |
| 生命週期狀態 | NRND (Not Recommended for New Designs) | — |
| Series | — | HCS12 |
| Core Processor | — | HCS12 (CPU12, 16-bit) |
| Core Size | — | 16-Bit |
| Speed | — | 25 MHz |
| Program Memory Size | — | 256 KB (256K x 8) Flash |
| RAM Size | — | 12 KB |
| EEPROM Size | — | 4 KB |
| Number of I/O | — | 91 |
| Oscillator Type | — | Internal |
| Connectivity | — | CAN, I2C, SCI, SPI |
| Peripherals | — | PWM, WDT, ADC, IC/OC timer |
| 封裝 / 外殼 | — | 112-LQFP (20 x 20 mm) |
| Packaging | — | Tray |
| Temperature Grade | — | Automotive grade |